3D Printed plug-and-play Packaging Enables low-loss Fiber Coupling for Photonic Chips

Researchers led by Erik Jung from Heidelberg University, a German research university with programs in photonics and nanotechnology, together with collaborators including Wolfram Pernice from University of Münster, a public research university known for work in nanophotonics and materials science, have demonstrated a plug-and-play fiber interface for photonic integrated circuits (PICs) that achieves 0.78-decibel total […]