DissolvPCB enables fully recyclable 3D-printed circuit boards with liquid metal conductors

Researchers from the University of Maryland, Georgia Tech and the University of Notre Dame, have introduced DissolvPCB, a novel 3D printing-based method to fabricate fully recyclable electronic circuits. Presented at UIST 2025, the technique combines polyvinyl alcohol (PVA) substrates and eutectic gallium–indium (EGaIn) liquid metal to create printed circuit board assemblies (PCBAs) that can be […]