Integrating robust electrical functions directly into 3D printed components using standard wires

The Fraunhofer Institute for Machine Tools and Forming Technology (IWU) will unveil the latest generation of its Wire Encapsulating Additive Manufacturing (WEAM) technology at Formnext 2025 in Frankfurt, Germany. The new system enables the direct integration of electrical functions into components using standard wires and cables, eliminating the need for conductive pastes, inks, or powders. […]