MIT and Inkbit Scalable Spectral Packing method boosts 3D printing throughout

A team of researchers at MIT CSAIL has collaborated with multi-material 3D printer developer Inkbit, to develop a novel computational methodology to improve the dense packing of objects.  Called “dense, interlocking-free and Scalable Spectral Packing” (SSP), this method offers significant potential for additive manufacturing. The research suggests that SSP can maximize 3D printing throughput, by […]