New 3D Printing Method for Electronics

Engineers at The University of Texas at Austin are developing a new 3D printing method called Holographic Metasurface Nano-Lithography (HMNL), aimed at making electronics packaging for semiconductor chips faster, more efficient, and environmentally sustainable. “Our goal is to fundamentally change how electronics are packaged and manufactured,” said Michael Cullinan, an associate professor in the Cockrell […]